Apple is reportedly engaged on a thinner and lighter motherboard that might enable the iPhone 17, anticipated in 2025, to accommodate extra parts and probably improve its battery life. Apple analyst Ming-Chi Kuo has revealed that the corporate could undertake a cloth referred to as RCC (resin coated copper) for the motherboard, which may scale back its thickness and make the drilling course of simpler. Nonetheless, Kuo believes that RCC won’t be prepared for the iPhone 16 in 2024 as a result of its fragility and incapacity to move drop assessments.
Using RCC in future iPhones would require strengthening the fabric to make sure it could actually stand up to unintentional drops. Apple has already taken steps to strengthen its gadgets with options like Ceramic Defend, designed to guard in opposition to accidents. Kuo means that Apple could obtain the required energy for RCC within the close to future, making it attainable for the fabric to debut within the iPhone 17.
Apple might want to excellent the RCC mainboards earlier than the third quarter of 2024 to finalize its implementation for the following 12 months’s iPhone. If profitable, the usage of RCC motherboards may create extra house contained in the iPhone, enabling the addition of recent functionalities which can be at the moment limitedinternal house constraints. This might probably end result within the introduction of thrilling new options within the iPhone 17.
Whereas Apple’s plans for the iPhone 17 stay speculative, the event of a thinner and lighter motherboard signifies the corporate’s dedication to pushing the boundaries of know-how and design. Apple customers will eagerly anticipate the disclosing of the iPhone 17 to see the developments it brings.
Supply: Medium (Ming-Chi Kuo)
